CMP, also called thermal oxidation sharpening, utilizes MP together with chemicals to enhance the MRR and strengthen surface area top quality [twenty]. Determine two illustrates the schematic of a normal CMP process [21]. The SiC wafer, that's mounted within the provider, along with the sharpening pad move relative to each https://www.quora.com/profile/Trevor-Flatcher-2/Thermal-Conductivity-of-Silicon-Carbide-and-Heat-Dissipation-Solutions-for-Electronic-Devices-Thermal-management-is-a-c